Eaton MTL

MTL Instruments Group

Gas Applications

Flow Soldering.

Flow Soldering

Reflow soldering is a process in which a solder paste is used to temporarily attach one or more electrical components to their contact pads and is the most common method of attaching surface mount components to a circuit board. The goal of the reflow process is to melt the solder and heat the adjoining surfaces, without overheating and damaging the electrical components. Therefore, Nitrogen is frequently used as a blanket in flow soldering and reflow applications to avoid oxidation of the molten solder and to help to minimise cost, oxygen measurement is used to control the nitrogen flow.

To optimise the use of nitrogen and to ensure expensive re-working is avoided, our range of zirconia oxygen analysers monitor the oxygen content of the blanket inside the flow solder/reflow machine.

Displaying products in Flow Soldering

Z1030 - Zirconia Oxygen Analyser with Remote Sensor (Panel Mount)

Z1030 - Zirconia Oxygen Analyser with Remote Sensor (Panel Mount)

The Z1030 zirconia oxygen analyser measures a wide range of oxygen concentrations (from percentage levels…
Z130 - Rapid Response Zirconia Oxygen Analyzer (Rack Mount)

Z130 - Rapid Response Zirconia Oxygen Analyzer (Rack Mount)

The Z130 rapid response zirconia oxygen analyser is fully auto ranging from percentage levels to…